Classification and characteristics of common electronic encapsulated ceramic substrate materials

Classification and characteristics of common electronic encapsulated ceramic substrate materials


There are many kinds of electronic packaging substrates, and the commonly used substrates are mainly divided into plastic packaging substrates, metal packaging substrates and ceramic packaging substrates. Plastic packaging materials usually have low thermal conductivity and poor reliability, and are not suitable for high requirements. Metal packaging materials have high thermal conductivity, but the general thermal expansion coefficient does not match, and the price is high.Get more news about Electronic Ceramics,you can vist our website!

Ceramic substrates are commonly used in electronic packaging. Compared with plastic substrates and metal substrates, ceramic substrates have the following advantages :

(1) good insulation performance and high reliability;

(2) Low dielectric coefficient, high frequency performance;

(3) Low thermal expansion coefficient and high thermal conductivity;

(4) With good air tightness and stable chemical performance, it plays a strong protective role for the electronic system.

Therefore, it is suitable for aviation, aerospace and military engineering high reliability, high frequency, high temperature resistance, air tightness of the product packaging. Ultra-small chip electronic components are widely used in the fields of mobile communication, computer, household appliances and automobile electronics, etc., and their carrier materials are often encapsulated with ceramic substrates.

At present, several commonly used ceramic substrate materials for electronic packaging include alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), silicon carbide (SiC), boron nitride (BN), beryllium oxide (BeO).

Al2O3 ceramic substrate

Al2O3 ceramics generally refers to Al2O3 as main raw materials, mainly of alpha Al2O3 crystal phase, Al2O3 content in more than 75% of all kinds of ceramic, it has rich raw material sources, low cost, high mechanical strength and hardness, good insulation performance and good heat shock performance, chemical corrosion resistance, high dimensional accuracy, the advantages of good adhesion with metal, is a kind of comprehensive performance better ceramic substrate materials. Al2O3 ceramic substrate is widely used in electronic industry, accounting for 90% of the total amount of ceramic substrate, and has become an indispensable material for electronic industry.

Al2O3 ceramic substrates currently used are mostly multilayer substrates. Al2O3 content improves electrical insulation performance, thermal conductivity and impact resistance, but at the same time, it will lead to an increase in sintering temperature and production cost. In order to reduce the sintering temperature and ensure the mechanical and electrical properties of Al2O3 ceramic substrates, a certain amount of sintering AIDS, such as B2O3, MgO, CaO, SiO2, TiO2, Nb2O5, Cr2O3, CuO, Y2O3, La2O3 and Sm2O3, are often added to promote sintering.